This information was published on 2026-02-06T16:05:13 for IP Right Filed Published.
| Field | Value |
| (210) | 2625336 |
| (220) |
06 Feb 2026
|
| (511) (510) |
Class 9
Semiconductor packaging platforms for integrating multiple semiconductor chips into a single package; Semiconductor packages, namely, semiconductor dies and interconnects; Multi-chip semiconductor packages; Semiconductor chips; Semiconductor wafers; Structured semiconductor wafers; Semiconductor substrates for semiconductor packaging; Semiconductor devices in the nature of substrates for semiconductor packaging, chips and circuit boards; Interposers for semiconductor packaging; Silicon bridges for semiconductor packaging; Semiconductor chip sets. Class 40 Etching of semiconductor wafers; Etching of integrated circuits; Semiconductor wafer-level processing; Wafer foundry services, namely, custom manufacture of semiconductor wafers for others; Custom manufacture of semiconductor packaging in the nature of semiconductor dies and interconnects, semiconductor chip housings and semiconductor integrated circuit modules; Integrated circuit packaging processing in the nature of manufacturing services for others; Semiconductor packaging processing in the nature of manufacturing services for others; Custom manufacture of semiconductor substrates for others; Substrate foundry services, namely, manufacturing of semiconductor substrates for others. Class 42 Technology research and development for others in the field of semiconductor-related products; Integrated circuit design services; Semiconductor packaging design services; Semiconductor substrate design services; Quality control inspection of semiconductors and semiconductor-related products; Testing of semiconductors and semiconductor-related products; Consulting services with respect to semiconductor packaging technology, namely, consulting regarding semiconductor packaging design and development; Design services for others in the field of semiconductor packaging; Consulting services in the field of semiconductor electromechanical engineering; Consulting services in the field of semiconductor packaging and semiconductor testing. |
| (540) | Samsung 2.3D Cube-E |
| (550) | Word |
| (730) |
Samsung Electronics Co., Ltd.
|
| (750) |
Spruson & Ferguson
|
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